Condition Monitoring of Surface Grinding Process Using Low-Cost Vibration Sensor Module

被引：0
|
作者：
Seth, Shivam [1 ]
Bhashkar, Avinash [1 ]
Vats, Prameet [1 ]
Singh, Tushar [1 ]
Ahmed, Farooqui Rizwan [1 ]
Keshari, Anupam [1 ]
机构：
[1] Dr APJ Abdul Kalam Tech Univ, Ctr Adv Studies, Lucknow, Uttar Pradesh, India
来源：
RECENT ADVANCES IN SMART MANUFACTURING AND MATERIALS, ICEM 2020 | 2021年
关键词：
D O I：
10.1007/978-981-16-3033-0_39
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：413 / 421
页数：9
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