Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process

被引：0
|
作者：
Zhang, Lei [1 ]
Zhao, Guoqun [1 ]
Li, Huiping [1 ]
机构：
[1] Shandong Univ, Minist Educ, Key Lab Liquid Solid Struct Evolut & Proc Mat, Jinan 250061, Peoples R China
来源：
FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE, PTS 1-4 | 2011年 / 44-47卷
关键词：
Hot stamping; Die; Temperature; Heat transfer; STEEL; BEHAVIOR;
D O I：
10.4028/www.scientific.net/AMM.44-47.992
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.
引用
收藏
页码：992 / 996
页数：5
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