A MEMS Based Measurement System for Structure Health Monitoring Applications

被引：0
|
作者：
Majcherek, Soeren [1 ]
Hirsch, Soeren [1 ]
Schmidt, Bertram [2 ]
机构：
[1] Otto VonGuericke Univ Magdegurg, TEPROSA, Post Box 4120, D-39016 Magdeburg, Germany
[2] Otto von Guericke Univ Magdeburg IMOS, D-39016 Magdeburg, Germany
来源：
HEALTH MONITORING OF STRUCTURAL AND BIOLOGICAL SYSTEMS 2010, PTS 1 AND 2 | 2010年 / 7650卷
关键词：
MEMS; experimental stress analysis; piezo resistive;
D O I：
10.1117/12.846736
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
The structure health monitoring becomes more and more important to increase the reliability of important assemblies and structures. Therefore, a silicon test chip was developed to analyse acting mechanical loads at critical structure locations. Standard MEMS technologies are used for manufacturing an array structure of stress sensitive elements. Up to 16 sections with each 6 stress sensitive resistors can be measured continuously by one measurement hardware unit. Interpretation and correction of the measured raw data is performed in proper computer software. The whole system can be utilized as a self-sufficient measurement chain for structure health monitoring.
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页数：9
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