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Band bending measurement of HfO2/SiO2/Si capacitor with ultra-thin La2O3 insertion by XPS
被引:14
|作者:
Kakushima, K.
[1
]
Okamoto, K.
[1
]
Adachi, M.
[1
]
Tachi, K.
[1
]
Song, J.
[1
]
Sato, S.
[1
]
Kawanago, T.
[1
]
Ahmet, P.
[2
]
Tsutsui, K.
[1
]
Sugii, N.
[1
]
Hattori, T.
[2
]
Iwai, H.
[2
]
机构:
[1] Tokyo Inst Technol, Interdisciplinary Grad Sch Sci & Engn, Midori Ku, Yokohama, Kanagawa 2268502, Japan
[2] Tokyo Inst Technol, Frontier Res Ctr, Tokyo, Japan
关键词:
high-k;
flat band voltage;
hard X-ray photoemission spectroscopy (HX-PES);
D O I:
10.1016/j.apsusc.2008.02.177
中图分类号:
O64 [物理化学(理论化学)、化学物理学];
学科分类号:
070304 ;
081704 ;
摘要:
The flat band voltage shifts of HfO(2)/SiO(2)/nSi capacitors with ultra-thin La(2)O(3) insertion at HfO(2)/SiO(2) interface have been confirmed using hard X-ray photoelectron spectroscopy (HX-PES). By increasing the amount of La(2)O(3) insertion, the binding energy of Si 1s core spectra increases, which means that the surface potential of Si substrate also increases. A voltage drop difference of HfO(2) and La(2)O(3) at SiO(2) interface can be estimated to be 0.40 V. (c) 2008 Elsevier B.V. All rights reserved.
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页码:6106 / 6108
页数:3
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