NARROW FOOTPRINT COPPER SEALING RINGS FOR LOW-TEMPERATURE HERMETIC WAFER-LEVEL PACKAGING

被引：0

作者：

Wang, Xiaojing ^{[1
]}

Bleiker, Simon J. ^{[1
]}

Antelius, Mikael ^{[2
]}

Stemme, Goran ^{[1
]}

Niklaus, Frank ^{[1
]}

机构：

[1] KTH Royal Inst Technol, Dept Micro & Nanosyst, Stockholm, Sweden

[2] APR Technol AB, Enkoping, Sweden

来源：

2017 19TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2017年

关键词：

MICROSTRUCTURE; ENCAPSULATION;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports a narrow footprint sealing ring design for low-temperature, hermetic, and mechanically stable wafer-level packaging. Copper (Cu) sealing rings that are as narrow as 8 mu m successfully seal the enclosed cavities on the wafers after bonding at a temperature of 250 degrees C. Different sealing structure designs are evaluated and demonstrate excellent hermeticity after 3 months of storage in ambient atmosphere. A leak rate of better than 3.6x10-16 mbarL/s is deduced based on results from residual gas analysis measurements. The sealing yield after wafer bonding is found to be not limited by the Cu sealing ring width but by a maximum acceptable wafer-to-wafer misalignment.

引用

页码：423 / 426

页数：4

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