Numerical Investigation of Electrohydrodynamic-Conduction Pumping of Liquid Film in the Presence of Evaporation

被引:20
|
作者
Yazdani, Miad [1 ]
Seyed-Yagoobi, Jamal [1 ]
机构
[1] IIT, Two Phase Flow & Heat Transfer Enhancement Lab, Mech Mat & Aerosp Engn Dept, Chicago, IL 60616 USA
来源
关键词
EHD-conduction; liquid film; evaporation; DIELECTRIC LIQUIDS; EHD PUMP; CONFIGURATION; FLUID;
D O I
10.1115/1.2993542
中图分类号
O414.1 [热力学];
学科分类号
摘要
Electrohydrodynamic (EHD) conduction pumping is associated with the heterocharge layers of finite thickness in the vicinity of the electrodes, generated by the process of dissociation of the neutral electrolytic species and the recombination of the generated ions. This paper numerically investigates the EHD-conduction pumping of a liquid film in the presence of evaporation. The flow system comprises a liquid film flowing over a two-dimensional flat plate. The vapor phase above the flat plate is extended far beyond the interface. The channel is separated into four different sections: the entrance, electrode, evaporation, and downstream sections. The entrance, electrode, and downstream regions are adiabatic while a constant heat flux is applied in the evaporation section. The concept of EHD-conduction pumping of liquid film in the presence of phase change is numerically demonstrated in this paper. The resultant heat transfer due to conduction pumping is evaluated as well. The results for heat transfer coefficient along the channel indicate considerable improvement of heat transfer coefficient compared with the pressure-driven counterpart. [DOI: 10.1115/1.2993542]
引用
收藏
页码:1 / 8
页数:8
相关论文
共 50 条
  • [21] NUMERICAL PERFORMANCE CHARACTERIZATION OF AN INNOVATIVE MICRO-SCALE ELECTROHYDRODYNAMIC CONDUCTION PUMPING DEVICE
    Talmor, Michal
    Yagoobi, Jamal
    PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017, 2017,
  • [22] LIQUID FILM EVAPORATION IN THE PRESENCE OF MICRO ENCAPSULATED PHASE CHANGE MATERIALS: A NUMERICAL STUDY
    Khakpour, Yasmin
    Seyed-Yagoobi, Jamal
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 8B, 2014,
  • [23] Effect of Gravity on Electrohydrodynamic Conduction Driven Liquid Film Flow Boiling
    Patel, Viral K.
    Seyed-Yagoobi, Jamal
    Robinson, Franklin
    Didion, Jeffrey R.
    JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2016, 30 (02) : 429 - 437
  • [24] Electrohydrodynamic induction pumping of a stratified liquid/vapor medium in the presence of heat transfer
    Brand, K.
    Seyed-Yagoobi, J.
    American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, 2000, 366 : 153 - 160
  • [25] THE LIQUID FILM FLOW WITH EVAPORATION: NUMERICAL MODELLING
    Rezanova, Ekaterina
    HEAT AND MASS TRANSFER IN THE SYSTEM OF THERMAL MODES OF ENERGY - TECHNICAL AND TECHNOLOGICAL EQUIPMENT (HMTTSC-2016), 2016, 72
  • [26] Experimental Study of Pumping of Liquid Film With Electric Conduction Phenomenon
    Siddiqui, Muhammad A. W.
    Seyed-Yagoobi, Jamal
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2009, 45 (01) : 3 - 9
  • [27] Numerical study of falling binary liquid film evaporation: liquid film thickness
    Nasr, Abdelaziz
    Al-Ghamdi, Abdulmajeed S.
    Feddaoui, M'barek
    Alsoufi, Mohammad S.
    Ben Nasrallah, Sassi
    DESALINATION AND WATER TREATMENT, 2017, 74 : 35 - 43
  • [28] Stability of electrohydrodynamic induction pumping of a stratified liquid/vapor medium in the presence of an external load
    Wawzyniak, M
    Seyed-Yagoobi, J
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 1999, 35 (05) : 1211 - 1217
  • [29] Stability of electrohydrodynamic induction pumping of a stratified liquid/vapor medium in the presence of an external load
    Wawzyniak, M
    Seyed-Yagoobi, J
    CONFERENCE RECORD OF THE 1998 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-3, 1998, : 1828 - 1834
  • [30] Electrohydrodynamic induction pumping of a stratified liquid/vapor medium in the presence of volumetric and interface electric charges
    Wawzyniak, M
    Seyed-Yagoobi, J
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2001, 37 (04) : 950 - 958