Elementary processes governing V2AlC chemical etching in HF

被引:27
|
作者
Kim, Youngsoo [1 ,2 ]
Gkountaras, Athanasios [2 ,3 ]
Chaix-Pluchery, Odette [2 ]
Gelard, Isabelle [2 ]
Coraux, Johann [3 ]
Chapelier, Claude [1 ]
Barsoum, Michel W. [4 ]
Ouisse, Thierry [2 ]
机构
[1] Univ Grenoble Alpes, CEA, IRIG, PHELIQS, F-38054 Grenoble, France
[2] Univ Grenoble Alpes, CNRS, Grenoble INP, LMGP, F-38000 Grenoble, France
[3] Univ Grenoble Alpes, CNRS, Grenoble INP, Inst NEEL, F-38000 Grenoble, France
[4] Drexel Univ, Dept Mat Sci & Engn, Philadelphia, PA 19104 USA
关键词
TEMPERATURE SOLUTION GROWTH; RAMAN-SCATTERING; MAX PHASES; MXENE; NANOSHEETS; TI3ALC2; FAMILY; TI2ALC;
D O I
10.1039/d0ra00842g
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The literature on MXenes, an important class of 2D materials discovered in 2011, is now abundant. Yet, the lack of well-defined structures, with definite crystal orientations, has so far hindered our capability to identify some key aspects ruling MXene's chemical exfoliation from their parent MAX phase. Herein the chemical exfoliation of V2AlC is studied by using well-defined square pillars with lateral sizes from 7 mu m up to 500 mu m, processed from centimeter-sized V2AlC single crystals. The MXene conversion kinetics are assessed with mu m spatial resolution by combining Raman spectroscopy with scanning electron and optical microscopies. HF penetration, and the loss of the Al species, take place through the edges. At room temperature, and on a reasonable time scale, no etching can takes place by HF penetration through the basal planes,viz.normal to the basal planes. In defect-free pillars, etching through the edges is isotropic. Initially the etching rate is linear with a rate of 2.2 +/- 0.3 mu m h(-1)at 25 degrees C. At a distance of approximate to 45 mu m, the etching rate is greatly diminished.
引用
收藏
页码:25266 / 25274
页数:9
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