Physical processes in thermoelectric coolers

被引:0
|
作者
Bulat, LP [1 ]
Buzin, EV [1 ]
Whang, US [1 ]
机构
[1] St Petersburg State Univ Refrigerat, St Petersburg 191002, Russia
来源
TWENTIETH INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS | 2001年
关键词
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
A usage of the thermoelectric method of refrigeration is one of the best practical methods of cooling chips and other electronic components. The miniaturization of electronic elements requires the miniaturization of thermoelectric coolers for such electronics. The modem thermoelectric coolers may have a thickness of microns. Under these conditions, all transport regulations of thermoelectricity in semiconductors become incorrect. In the present paper a thermoelectric theory of microminiaturized thermoelectric coolers is proposed. The new nonlinear effects result in changing of all equations for heat and electric transport. Nonlinear analytical formulas for all kinetic coefficients and for thermoelectric figure of merit under such conditions have been derived. The theory shows that, in typical cases, the nonlinear effects could lead to an increase of the thermoelectric figure of merit and COP. Such a result is in consistent with known experimental data.
引用
收藏
页码:435 / 438
页数:4
相关论文
共 50 条
  • [31] A general approach in evaluating and optimizing thermoelectric coolers
    Zhang, H. Y.
    INTERNATIONAL JOURNAL OF REFRIGERATION-REVUE INTERNATIONALE DU FROID, 2010, 33 (06): : 1187 - 1196
  • [32] The Thomson effect and the ideal equation on thermoelectric coolers
    Lee, HoSung
    ENERGY, 2013, 56 : 61 - 69
  • [33] Geometric effects on the transient cooling of thermoelectric coolers
    Yang, RG
    Chen, G
    Snyder, GJ
    Fleuriel, JP
    THERMOELECTRIC MATERIALS 2001-RESEARCH AND APPLICATIONS, 2001, 691 : 281 - 286
  • [34] Thermoelectric Coolers (TECs): From Theory to Practice
    Guclu, Tamer
    Cuce, Erdem
    JOURNAL OF ELECTRONIC MATERIALS, 2019, 48 (01) : 211 - 230
  • [35] An assessment of module cooling enhancement with thermoelectric coolers
    Simons, RE
    Ellsworth, MJ
    Chu, RC
    ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 641 - 650
  • [36] THERMOELECTRIC COOLERS FOR THERMAL GRADIENT MANAGEMENT ON CHIP
    Sullivan, Owen
    Gupta, Man Prakash
    Mukhopadhyay, Saibal
    Kumar, Satish
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4, 2012, : 199 - +
  • [37] A Model for Material Metrics in Thermoelectric Thomson Coolers
    Zebarjadi, Mona
    Akbari, Omid
    ENTROPY, 2023, 25 (11)
  • [38] Investigation of thermal contact effect on thermoelectric coolers
    Xuan, XC
    ENERGY CONVERSION AND MANAGEMENT, 2003, 44 (03) : 399 - 410
  • [39] Fuel cell thermal management with thermoelectric coolers
    Parise, RJ
    Jones, GF
    2002 37TH INTERSOCIETY ENERGY CONVERSION ENGINEERING CONFERENCE (IECEC), 2002, : 607 - 614
  • [40] Design and characterization of cold point thermoelectric coolers
    Ghoshal, U
    XXI INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '02, 2002, : 540 - 543