A Miniaturized Via-Patch Loaded Dual-Layer RFID Tag Antenna for Metallic Object Applications

被引：32
|
作者：
Zhang, Jun [1 ,2 ]
Long, Yunliang [1 ,2 ]
机构：
[1] Sun Yat Sen Univ, Dept Elect & Commun Engn, Guangzhou 510006, Guangdong, Peoples R China
[2] SYSU CMU Shunde Int Joint Res Inst, Foshan 528300, Peoples R China
来源：
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS | 2013年 / 12卷
关键词：
Electrically small antenna (ESA); equivalent circuit model; high impedance surface (HIS); metallic surface; radio frequency identification (RFID); tag antenna; ultra-high frequency (UHF); via-patch loaded; DESIGN;
D O I：
10.1109/LAWP.2013.2281842
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this letter, a dual-layer radio frequency identification (RFID) tag antenna is proposed. By embedding a slotted via-patch in the middle layer, the proposed antenna is miniaturized to a total volume of 28 x 14 x 3.2 mm(3). At the same time, the loaded via-patch makes the antenna input impedance be flexibly tuned in a large scale. Moreover, an equivalent circuit model is given out to explicate how this via-patch functions. The measured read ranges with and without a metallic plate were 1.8 and 2 m, respectively, which implies the proposed antenna is a good candidate in metallic object applications, especially in size-constrained scenarios.
引用
收藏
页码：1184 / 1187
页数：4
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