Heat loads in inboard limited L-mode plasmas in TCV

被引:14
|
作者
Nespoli, F. [1 ]
Labit, B. [1 ]
Furno, I. [1 ]
Canal, G. P. [1 ]
Fasoli, A. [1 ]
机构
[1] Ecole Polytech Fed Lausanne, Ctr Rech Phys Plasmas, CH-1015 Lausanne, Switzerland
关键词
D O I
10.1016/j.jnucmat.2014.11.137
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Infrared thermography is used in TCV to measure the heat flux deposited onto the graphite tiles of the inner wall. The heat flux radial profile is found to be well described by the sum of a main parallel component and a non negligible cross-field component. The latter accounts for about 20% of the deposited heat flux. The parallel component shows an enhancement around the contact point in all discharges under consideration. Main plasma parameters, such as density, current, elongation and triangularity have been varied, allowing for empirical scalings of the heat fluxes. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:393 / 396
页数:4
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