Etching and structural changes in nitrogen plasma immersion ion implanted polystyrene films

被引：50
|
作者：
Gan, B. K. [1 ]
Bilek, M. M. M. [1 ]
Kondyurin, A. [1 ]
Mizuno, K. [1 ]
McKenzie, D. R. [1 ]
机构：
[1] Univ Sydney, Sch Phys A28, Sydney, NSW 2006, Australia
来源：
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS | 2006年 / 247卷 / 02期
基金：
澳大利亚研究理事会;
关键词：
polystyrene; polymer modification; ion implantation; amorphous carbon; DLC; optical properties;
D O I：
10.1016/j.nimb.2006.01.063
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
Plasma immersion ion implantation (PIII), with nitrogen ions of energy 20 keV in the fluence range of 5 x 10(14)-2 x 10(16) ions cm(-2), is used to modify 100 nm thin films of polystyrene on silicon wafer substrates. Ellipsometry is used to study changes in thickness with etching and changes in optical constants. Two distinctly different etch rates are observed as the polymer structure is modified. FTIR spectroscopy data reveals the structural changes, including changes in aromatic and aliphatic groups and oxidation and carbonisation processes, occurring in the polystyrene film as a function of the ion fluence. The transformation to a dense amorphous carbon-like material was observed to progress through an intermediate structural form containing a high concentration of C=C and C=O bonds. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码：254 / 260
页数：7
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