Copper Pillar Bump Design Optimization Based on Taguchi Method

As the demand expanding for high electrical performance, high pin count and low cost, the copper pillar bump packaging has been extensively used in recent years. However, the drawback is that copper pillar bump can introduce high stress, especially on low-k chip. In this paper, finite element method was adopted to optimize the structure of copper pillar bump, aiming at relieving the stress of low-k layer during reflow process and improving the reliability of electronic packages. A strip finite element model was established. Then, the copper pillar bump structure factors, such as the thickness of die, die size, the diameter of copper pillar etc., were separately analyzed by finite element method. Taguchi experiments were carried out to analyze the significant structure factors which we got before, and a L-27(3(8)) orthogonal array was established. Finally, we got the significance of these important structure factors and their optimal combination.