Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

被引:23
|
作者
Su, Lei [1 ]
Shi, Tielin [1 ]
Xu, Zhensong [1 ]
Lu, Xiangning [2 ]
Liao, Guanglan [1 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
[2] Jiangsu Normal Univ, Xuzhou 221116, Peoples R China
来源
SENSORS | 2013年 / 13卷 / 12期
基金
中国国家自然科学基金;
关键词
SUPPORT-VECTOR MACHINES; NEURAL-NETWORKS; JOINTS; THERMOGRAPHY; RECOGNITION; PACKAGE;
D O I
10.3390/s131216281
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where solder bump inspection of surface mount packages is crucial in the electronics manufacturing industry. In this study we demonstrate the feasibility of using a 230 MHz ultrasonic transducer for nondestructive flip chip testing. The reflected time domain signal was captured when the transducer scanning the flip chip, and the image of the flip chip was generated by scanning acoustic microscopy. Normalized cross-correlation was used to locate the center of solder bumps for segmenting the flip chip image. Then five features were extracted from the signals and images. The support vector machine was adopted to process the five features for classification and recognition. The results show the feasibility of this approach with high recognition rate, proving that defect inspection of flip chip solder bumps using the ultrasonic transducer has high potential in microelectronics packaging. © 2013 by the authors; licensee MDPI, Basel, Switzerland.
引用
收藏
页码:16281 / 16291
页数:11
相关论文
共 50 条
  • [41] Study of the UBM to copper interface robustness of solder bumps in flip chip packages
    Dreybrodt, J.
    Dupraz, Y.
    MICROELECTRONICS RELIABILITY, 2014, 54 (9-10) : 1969 - 1971
  • [42] The simulation and analysis of current crowding and Joule heat in flip chip solder bumps
    Liu, Peisheng
    Yang, Longlong
    Hang, Jinxin
    Lu, Ying
    Key Engineering Materials, 2015, 645 : 319 - 324
  • [43] Ultra low alpha emission lead free solder for flip chip bumps
    Moriwaka, Y
    Takahashi, S
    Kohinata, M
    Uchiyama, N
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 559 - 564
  • [44] Fabrication of a flip chip solder bump using a thin mold and ultrasonic filling
    Nam, Dong Jin
    Lee, Jae Hak
    Lee, Jihye
    Yoo, Choong Don
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (09) : 1863 - 1869
  • [45] Defect detection of flip-chip solder joints using modal analysis
    Liu, Junchao
    Shi, Tielin
    Wang, Ke
    Tang, Zirong
    Liao, Guanglan
    MICROELECTRONICS RELIABILITY, 2012, 52 (12) : 3002 - 3010
  • [46] Vibration analysis based modeling and defect recognition for flip-chip solder-joint inspection
    Liu, S
    Ume, IC
    JOURNAL OF ELECTRONIC PACKAGING, 2002, 124 (03) : 221 - 226
  • [47] Flip chip solder bumping using solder pastes
    Elenius, P
    1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 116 - 121
  • [49] A NOVEL FLIP-CHIP INTERCONNECTION TECHNIQUE USING SOLDER BUMPS FOR HIGH-SPEED PHOTORECEIVERS
    KATSURA, K
    HAYASHI, T
    OHIRA, F
    HATA, S
    IWASHITA, K
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 1990, 8 (09) : 1323 - 1327
  • [50] Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique
    Reddy, Vishnu V. B.
    Ume, I. Charles
    Mebane, Aaron
    Imediegwu, Chidinma
    Akinade, Kola
    Chaudhuri, Amiya R.
    Rogers, Bryan
    Hill, Mark
    Guirguis, Cherif
    Lee, Tae-Kyu
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 764 - 770