共 50 条
- [33] Effect of polished surface on the structure of alloy film with copper substrate Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering, 2007, (05): : 64 - 67
- [35] Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits International Journal of Fracture, 2001, 109 : 91 - 121
- [37] Effect of heat transfer surface structure on wall temperature and void fraction characteristics in boiling transition Multiph Sci Technol, 2-4 (133-146):
- [40] The Effect of Void Structure on the Permeability of Fibrous Networks Transport in Porous Media, 2017, 117 : 247 - 259