A W-Band Low-Loss and Wideband LTCC Transition From Waveguide to Microstrip

被引：18

作者：

Cao, Baolin ^{[1
]}

Wang, Hao ^{[1
]}

Huang, Yong ^{[2
]}

Wang, Jie ^{[2
]}

Sheng, Weixing ^{[1
]}

机构：

[1] Nanjing Univ Sci & technol, Sch Elect & Opt Engn, Nanjing 210094, Jiangsu, Peoples R China

[2] Su Zhou Bohai Microsyst Co LTD, Suzhou 215000, Peoples R China

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2013年 / 23卷 / 11期

关键词：

Low-loss; LTCC; transition; W-band; wideband; INTEGRATED TRANSITION;

D O I：

10.1109/LMWC.2013.2281431

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A broadband transition structure from rectangular waveguide (RWG) to microstrip line (MSL) is presented for the realization of the low-loss packaging module using Low-temperature co-fired ceramic (LTCC) technology at W-band. In this transition, a cavity structure is buried in LTCC layers, which provides the wide bandwidth, and a laminated waveguide (LWG) transition is designed, which provides the low-loss performance, as it reduces the radiation loss of conventional direct transition between RWG and MSL. The design procedure is also given. The measured results show that the insertion loss of better than 0.7 dB from 86 to 97 GHz can be achieved.

引用

页码：572 / 574

页数：3

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