Forming solder joints by sintering eutectic tin-lead solder paste

被引：6
|
作者：
Palmer, MA
Alexander, CN
Nguyen, B
机构：
[1] Rensselaer Polytech Inst, Ctr Integrated Elect Elect Mfg & Elect Media, Troy, NY 12180 USA
[2] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1999年 / 28卷 / 07期
关键词：
Sn-Pb paste; sintering; solder joints;
D O I：
10.1007/s11664-999-0219-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
It is possible to form solder joints with mechanical integrity, but not mechanical strength comp arable to that achieved by melting the solder, by sintering eutectic tin-lead solder paste where small amounts of eutectic Sn-Bi powder are added to the paste. This increases the rate of sintering through liquid-phase sintering.
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页码：912 / 915
页数：4
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