Silicon field emitter arrays produced via wafer dicing

被引：0
|
作者：
Kusch, Alexander [1 ]
Wurz, Marc [1 ]
Bunert, Erik [2 ]
Zimmermann, Stefan [2 ]
机构：
[1] Leibniz Univ Hannover, Inst Micro Prod Technol, Hannover, Germany
[2] Leibniz Univ Hannover, Inst Elect Engn & Measurement Technol, Hannover, Germany
来源：
2017 30TH INTERNATIONAL VACUUM NANOELECTRONICS CONFERENCE (IVNC) | 2017年
关键词：
field emitter; dicing; silicon; emission; chipping;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.
引用
收藏
页码：132 / 133
页数：2
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