Silicon field emitter arrays produced via wafer dicing

被引：0

作者：

Kusch, Alexander ^{[1
]}

Wurz, Marc ^{[1
]}

Bunert, Erik ^{[2
]}

Zimmermann, Stefan ^{[2
]}

机构：

[1] Leibniz Univ Hannover, Inst Micro Prod Technol, Hannover, Germany

[2] Leibniz Univ Hannover, Inst Elect Engn & Measurement Technol, Hannover, Germany

来源：

2017 30TH INTERNATIONAL VACUUM NANOELECTRONICS CONFERENCE (IVNC) | 2017年

关键词：

field emitter; dicing; silicon; emission; chipping;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.

引用

页码：132 / 133

页数：2

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