Step-stress analysis for predicting dental ceramic reliability

被引:32
|
作者
Borba, Marcia [1 ]
Cesar, Paulo F. [2 ]
Griggs, Jason A. [3 ]
Della Bona, Alvaro [1 ]
机构
[1] Univ Passo Fundo, Postgrad Program Dent, Sch Dent, BR-99052900 Passo Fundo, RS, Brazil
[2] Univ Sao Paulo, Biomat & Oral Biol Dept, Sch Dent, Sao Paulo, Brazil
[3] Univ Mississippi, Med Ctr, Dept Biomed Mat Sci, Jackson, MS 39216 USA
基金
巴西圣保罗研究基金会;
关键词
Ceramics; Aging; Fatigue; SUBCRITICAL CRACK-GROWTH; RESTORATIONS IN-VITRO; CYCLIC FATIGUE; ORAL ENVIRONMENT; FAILURE ANALYSIS; STRENGTH; ZIRCONIA; ALUMINA; FRACTOGRAPHY; PROPAGATION;
D O I
10.1016/j.dental.2013.05.009
中图分类号
R78 [口腔科学];
学科分类号
1003 ;
摘要
Objective. To test the hypothesis that step-stress analysis is effective to predict the reliability of an alumina-based dental ceramic (VITA In-Ceram AL blocks) subjected to a mechanical aging test. Methods. Bar-shaped ceramic specimens were fabricated, polished to 1 mu m finish and divided into 3 groups (n = 10): (1) step-stress accelerating test; (2) flexural strength-control; (3) flexural strength-mechanical aging. Specimens from group 1 were tested in an electromagnetic actuator (MTS Evolution) using a three-point flexure fixture (frequency: 2 Hz; R = 0.1) in 37 degrees C water bath. Each specimen was subjected to an individual stress profile, and the number of cycles to failure was recorded. A cumulative damage model with an inverse power law lifetime-stress relation and Weibull lifetime distribution were used to fit the fatigue data. The data were used to predict the stress level and number of cycles for mechanical aging (group 3). Groups 2 and 3 were tested for three-point flexural strength (sigma) in a universal testing machine with 1.0 MPa/s stress rate, in 37 degrees C water. Data were statistically analyzed using Mann-Whitney Rank Sum test. Results. Step-stress data analysis showed that the profile most likely to weaken the specimens without causing fracture during aging (95% CI: 0-14% failures) was: 80 MPa stress amplitude and 10(5) cycles. The median sigma values (MPa) for groups 2 (493 +/- 54) and 3 (423 +/- 103) were statistically different (p = 0.009). Significance. The aging profile determined by step-stress analysis was effective to reduce alumina ceramic strength as predicted by the reliability estimate, confirming the study hypothesis. (c) 2013 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:913 / 918
页数:6
相关论文
共 50 条
  • [21] Reliability Assessment of LED Luminaires Based on Step-stress Accelerated Degradation Test
    Ren, Rongbin
    Yang, Daoguo
    Cai, Miao
    Gong, Ming
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1495 - 1499
  • [22] Reliability Evaluation of LED Luminaires Based on Step-Stress Accelerated Degradation Test
    Tian, Wanchun
    Yang, Daoguo
    PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II, 2014, : 750 - 755
  • [23] A Study on the Storage Reliability of LSINS Based on Step-stress Accelerated Life Test
    Teng, Fei
    Liu, Yuanyuan
    Huang, Baosheng
    INTERNATIONAL CONFERENCE ON ENGINEERING TECHNOLOGY AND APPLICATION (ICETA 2015), 2015, 22
  • [24] Step-stress accelerated degradation analysis for highly reliable products
    Tseng, ST
    Wen, ZC
    JOURNAL OF QUALITY TECHNOLOGY, 2000, 32 (03) : 209 - 216
  • [25] Analysis of Weibull Step-Stress Model In Presence of Competing Risk
    Samanta, Debashis
    Gupta, Arindam
    Kundu, Debasis
    IEEE TRANSACTIONS ON RELIABILITY, 2019, 68 (02) : 420 - 438
  • [26] Analysis of simple step-stress model in presence of competing risks
    Ganguly, Ayon
    Kundu, Debasis
    JOURNAL OF STATISTICAL COMPUTATION AND SIMULATION, 2016, 86 (10) : 1989 - 2006
  • [27] Optimum 3-step step-stress tests
    Khamis, IH
    Higgins, JJ
    IEEE TRANSACTIONS ON RELIABILITY, 1996, 45 (02) : 341 - 345
  • [28] A new model for step-stress testing
    Khamis, IH
    Higgins, JJ
    IEEE TRANSACTIONS ON RELIABILITY, 1998, 47 (02) : 131 - 134
  • [29] Parametric inference for step-stress models
    Bagdonavicius, VB
    Gerville-Réache, L
    Nikulin, MS
    IEEE TRANSACTIONS ON RELIABILITY, 2002, 51 (01) : 27 - 31
  • [30] New model for step-stress testing
    Kansas State Univ, Manhattan, United States
    IEEE Trans Reliab, 2 (131-134):