Terabus: A 160-Gb/s bidirectional board-level optical data bus

被引：0

作者：

Doany, F. E. ^{[1
]}

Schow, C. L. ^{[1
]}

Kash, J. A. ^{[1
]}

Baks, C. ^{[1
]}

Budd, R. ^{[1
]}

Pepeljugoski, P. ^{[1
]}

Kuchta, D. ^{[1
]}

Dangel, R. ^{[2
]}

Horst, F. ^{[2
]}

Offrein, B. ^{[2
]}

机构：

[1] IBM Corp, TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA

[2] IBM Res GmbH, Zurich, Switzerland

来源：

2007 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2007年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A chip-to-chip optical interconnect on a printed circuit board achieves a 160-Gb/s aggregate bidirectional data rate through 32 parallel polymer waveguides at 13.5 mW/Gb/s. This is the fastest, widest, and most integrated optical bus ever demonstrated.

引用

页码：545 / +

页数：2

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