Thermal decomposition of silver acetate in silver paste for solar cell metallization: An effective route to reduce contact resistance

被引：11

作者：

Kim, Suk Jun ^{[1
]}

Kim, Se Yun ^{[1
]}

Park, Jin Man ^{[1
]}

Park, Keum Hwan ^{[1
]}

Lee, Jun Ho ^{[1
]}

Lee, Sang Mock ^{[1
]}

Han, In Taek ^{[1
]}

Kim, Do Hyang ^{[2
]}

Lim, Ka Ram ^{[2
]}

Kim, Won Tae ^{[3
]}

Park, Ju Cheol ^{[4
]}

Jee, Sang Soo ^{[1
]}

Lee, Eun-Sung ^{[1
]}

机构：

[1] SAIT, Elect Mat Lab, Yongin 446712, Gyeonggi Do, South Korea

[2] Yonsei Univ, Ctr Noncrystalline Mat, Dept Mat Sci & Engn, Seoul 120749, South Korea

[3] Cheongju Univ, Dept Opt Engn, Cheongju 360764, South Korea

[4] Seoul Natl Univ, Res Inst Adv Mat, Seoul 151742, South Korea

来源：

APPLIED PHYSICS LETTERS | 2013年 / 103卷 / 06期

关键词：

ALUMINUM;

D O I：

10.1063/1.4818124

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A screen printed silver/metallic glass (MG) paste formulated with Ag acetate resulted in a specific contact resistance in the range of 0.6-0.7 m Omega.cm(2) on both the n- and p-type Si emitters of interdigitated back-contact solar cells. Silver nanocrystallites resulting from thermally decomposed Ag acetate prevented the Al MG frits from directly interacting with the Si emitter, thus reducing the amount of Al diffused into the Si emitters, and subsequently, the contact resistance. A photovoltaic conversion efficiency of 20.3% was achieved using this technique. (C) 2013 AIP Publishing LLC.

引用

页数：4

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