Thermoelectric Properties of Off-Stoichiometric Ti-Ni-Sn Half-Heusler Systems

被引:3
|
作者
Hazama, Hirofumi [1 ]
Matsubara, Masato [1 ]
Asahi, Ryoji [1 ]
机构
[1] Toyota Cent Res & Dev Labs Inc, Nagakute, Aichi 4801192, Japan
关键词
Thermoelectric material; half-Heusler alloy; interstitial defect; CONDUCTIVITY;
D O I
10.1007/s11664-012-2048-z
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The Ti-Ni-Sn half-Heusler compound exhibits a high power factor but relatively low figure of merit due to its high thermal conductivity. In this paper, we propose an effective and inexpensive way to reduce the thermal conductivity, and independently increase the power factor. To this end, we have systematically synthesized off-stoichiometric Ti-Ni-Sn half-Heusler compounds and introduced Y-Sb dilute co-doping at Ti-Sn sites. Excess Ni introduces interstitial defects in the half-Heusler crystal and results in significant reduction of the thermal conductivity, which drops below 3 W/mK at room temperature. In addition, the Y-Sb dilute co-doping at Ti-Sn sites improves the power factor while the thermal conductivity remains reasonably small. As a result, the figure of merit at room temperature is eight times larger than that of nondoped Ti-Ni-Sn.
引用
收藏
页码:1730 / 1734
页数:5
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