High-power White LED Packaging Using Phosphor-in-Glass and Its Thermal Reliability

被引：0

作者：

Peng, Yang ^{[1
]}

Li, Ruixin ^{[2
]}

Cheng, Hao ^{[1
]}

Chen, Zhen ^{[1
]}

Chen, Mingxiang ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China

[2] Wuhan Univ Technol, State Key Lab Silicate Mat Architectures, Wuhan, Peoples R China

来源：

2016 13TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (SSLCHINA 2016) | 2016年

关键词：

LIGHT-EMITTING-DIODES; ENHANCEMENT;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper proposed a yellow YAG: Ce3+ based PiG for high-power white light-emitting diode (WLED) packaging, and its thermal reliability was systematically investigated. The PiG was fabricated by introducing yellow YAG: Ce3+ phosphor embedded with borosilicate glass through screen-printing and low-temperature sintering. The thermal aging tests of PiG were carried out and compared with the conventional phosphor-in-silicone (PiS). After aging of 200 degrees C for 500 h, the photoluminescence (PL) intensity of PiG is only reduced by 4.3%, which is much smaller than the PiS of 26.2%. In addition, The PiG-based WLEDs achieve the stable optical performance under the various aging conditions of PiG. The aging results show that the prepared PiG exhibits superior heat resistance characteristic, which induces the excellent thermal reliability for PiG-based WLEDs.

引用

页码：17 / 19

页数：3

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