A Study on the Measurement of Transient Thermal Characteristics for Multi-Layered Ceramic Substrate

Thermal design of power device package is important for safe and reliable operation of high power density circuit. The authors developed multi-layered ceramic substrate (MLCS) for fast switching operation of SiC power module. This paper evaluates the transient thermal characteristics of developed MLCSs based on static test method. Structure functions of the developed MLCS show the large heat conductivity of insulation layer gives small thermal resistance, because the thick Cu conduction layer widely spreads the heat on the lateral direction and lowers thermal resistance from the junction to heatsink.