Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

被引：10
|
作者：
Jeong, Haksan [1 ]
Min, Kyung Deuk [1 ]
Lee, Choong-Jae [1 ]
Kim, Jae-Ha [1 ]
Jung, Seung-Boo [1 ]
机构：
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, 2066 Seobu Ro,KS002, Suwon 16419, South Korea
来源：
MICROELECTRONICS RELIABILITY | 2020年 / 112卷
基金：
新加坡国家研究基金会;
关键词：
Cu core solder ball; Sn-3.0Ag-0.5Cu; Thermal shock test; Finite element method; OSP; SN-AG; INTERFACIAL REACTIONS; CREEP-BEHAVIOR; SHEAR TEST; JOINTS; FAILURE; ELECTROMIGRATION; HISTORY;
D O I：
10.1016/j.microrel.2020.113918
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A Cu-cored solder ball (CCSB) is often used as the interconnection material for 3D package. The CCSB has a Cu core surrounded by Sn-Ag-Cu alloy. The effect of the Cu core on mechanical reliability of the CCSB was investigated using thermal shock test. Microstructure and thermal shock reliability of the CCSB with organic solderability preservative (OSP) surface finish was compared with that of Sn-3.0wt.%Ag-0.5wt. %Cu (SAC) solder. The thermal shock test was performed in the temperature range of - 40 degrees C to 125 degrees C in compliance with JESD22-A104. Failure mechanism was analyzed by finite element method analysis. Average number of thermal shock cycles for the CCSB/OSP joints was 1.15 times higher than that for SAC/OSP joints. Maximum value of simulated plastic strain for the SAC/OSP joints was 1.25 times higher than that for the CCSB/OSP joints because the stand-off height of the CCSB/OSP joints could be maintained by the Cu core.
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页数：6
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