Package-on-Package for Chip Cooling with Embedded Fluidics

被引：0

作者：

Chua, Tiffany ^{[1
]}

Babikian, Sarkis ^{[1
]}

Wu, Liang ^{[1
]}

Li, G. -P. ^{[1
]}

Bachman, Mark ^{[1
]}

机构：

[1] Univ Calif Irvine, Irvine, CA 92697 USA

来源：

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年

关键词：

HEAT-TRANSFER; CONVECTION; MICROCHANNELS; FLOW;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm(2). Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a "package-on-package" construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.

引用

页码：1605 / 1612

页数：8

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