Package-on-Package for Chip Cooling with Embedded Fluidics

被引：0
|
作者：
Chua, Tiffany [1 ]
Babikian, Sarkis [1 ]
Wu, Liang [1 ]
Li, G. -P. [1 ]
Bachman, Mark [1 ]
机构：
[1] Univ Calif Irvine, Irvine, CA 92697 USA
来源：
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年
关键词：
HEAT-TRANSFER; CONVECTION; MICROCHANNELS; FLOW;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm(2). Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a "package-on-package" construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.
引用
收藏
页码：1605 / 1612
页数：8
相关论文
共 50 条
  • [1] Thin Profile Flip Chip Package-on-Package Development
    Hsieh, Ming-Che
    Kang, KeonTaek
    Choi, HangChul
    Kim, YoungCheol
    2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 143 - 147
  • [2] Development of Package-on-Package Using Embedded Wafer-Level Package Approach
    Chong, Ser Choong
    Wee, David Ho Soon
    Rao, Vempati Srinivasa
    Vasarla, Nagendra Sekhar
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (10): : 1654 - 1662
  • [3] Vibrational fatigue and reliability of package-on-package stacked chip assembly
    Yang, Bing
    Li, Dongbo
    Yang, Haiying
    Hu, Yongle
    Yang, Ping
    MICROELECTRONICS JOURNAL, 2019, 92
  • [4] Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package
    Han, Yong
    Lau, Boon Long
    Jung, Boo Yang
    Zhang, Xiaowu
    IEEE DESIGN & TEST, 2015, 32 (04) : 32 - 39
  • [5] A Novel Package-on-package Stacking Technique
    Sun, Xiaofeng
    Pan, Maoyun
    Lu, Yuan
    Wan, Lixi
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 34 - 36
  • [6] A study on package stacking process for package-on-package (PoP)
    Yoshida, Akito
    Taniguchi, Jun
    Murata, Katsumasa
    Kada, Morihiro
    Yamamoto, Yusuke
    Takagi, Yoshinori
    Notomi, Takeru
    Fujita, Asako
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 825 - +
  • [7] Thermal Characterization of Package-on-Package (POP)
    Bowers, Morris
    Lee, Yeong J.
    Joiner, Bennett
    Vijayaragavan, Niranjan
    TWENTY-FIFTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2009, : 309 - +
  • [8] Package-on-package: thinner, faster, denser
    Smith, Lee
    SOLID STATE TECHNOLOGY, 2011, 54 (07) : 26 - 28
  • [9] The development of the Fan-in Package-on-Package
    Carson, Flynn
    Lee, Seong Min
    Yoon, In Sang
    58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 956 - 963
  • [10] Decoupled Package-On-Package Thermal Characterization
    Galloway, Jesse E.
    Dreiza, Moody
    TWENTY-FIFTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2009, : 317 - 320
12345