Temperature field in the chip and its effect on chip curl

被引：0
|
作者：
Liu, YJ [1 ]
Xia, W [1 ]
机构：
[1] S China Univ Technol, Guangzhou 510641, Peoples R China
来源：
PROGRESS OF CUTTING AND GRINDING: WITH SOME TOPICS IN ADVANCED MANUFACTURE TECHNOLOGY | 1998年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, a model for heat conduction in metal cutting process is established. Based upon this model the expression of temperature distribution within the chip is derived It is shown that the temperature field within the chip is non-uniform one, which has significant effect on chip nature curl. Then a model of chip thermal deformation is established and the chip-curling curvature equation is obtained. The length of tool-chip contact zone is also discussed as an important boundary condition in this investigation.
引用
收藏
页码：473 / 477
页数：5
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