Real-time, Continuous Large Particle Monitoring for CMP Slurry Quality Control

With each new technology node, the cost of scratches during chemical-mechanical planarization (CMP) becomes higher in terms of tool downtime, process yield, and device reliability. Large particles (LPC) in the slurry are known to increase the likelihood of scratching; therefore, considerable resources are spent to quantify their number [1-4] and improve methods for detection [5, 6]. This paper explores a relatively new technology for large particle counting, the SlurryScope from Vantage Technology Corporation, as a potential means for more advanced processing and control of slurry supplied to the CMP line.