Real-time, Continuous Large Particle Monitoring for CMP Slurry Quality Control

被引：0

作者：

Kim, Andy ^{[1
]}

Murai, Koh ^{[1
]}

Parkin, Michael ^{[2
]}

Mavliev, Rashid ^{[2
]}

机构：

[1] Mega Fluid Syst, Tualatin, OR USA

[2] Vantage Technol Corp, Campbell, CA USA

来源：

2012 23RD ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2012年

关键词：

CMP; undiluted slurry; scratching; LPC;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

With each new technology node, the cost of scratches during chemical-mechanical planarization (CMP) becomes higher in terms of tool downtime, process yield, and device reliability. Large particles (LPC) in the slurry are known to increase the likelihood of scratching; therefore, considerable resources are spent to quantify their number [1-4] and improve methods for detection [5, 6]. This paper explores a relatively new technology for large particle counting, the SlurryScope from Vantage Technology Corporation, as a potential means for more advanced processing and control of slurry supplied to the CMP line.

引用

页码：227 / 230

页数：4

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