Toward chipscale integration of electronics, photonics, and plasmonics

被引：0
|
作者：
Dalton, Larry [1 ]
机构：
[1] Univ Washington, Seattle, WA 98195 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2017年 / 254卷
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D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
609
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页数：1
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