Experimental research on combined processing of diamond wire saw and molybdenum twisted wire

被引：2

作者：

Zhang, Ming ^{[1
]}

Liu, Zhidong ^{[1
]}

Pan, Hongwei ^{[1
]}

Deng, Cong ^{[1
]}

Ji, Yichao ^{[1
]}

Qiu, Mingbo ^{[1
]}

机构：

[1] Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Jiangsu, Peoples R China

来源：

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2019年 / 101卷 / 9-12期

基金：

中国国家自然科学基金;

关键词：

High-speed reciprocating traveling; WEDM; Twisted wire; Surface roughness; Recast layer; LAYER THICKNESS; WEDM PROCESS; EDM PROCESS; OPTIMIZATION;

D O I：

10.1007/s00170-018-3010-x

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

To improve the surface quality of multiple cutting and eliminate the recast layer in high-speed wire-cut electrical discharge machining (HSWEDM), a novel combined processing based on diamond wire saw and molybdenum twisted wire is proposed in this paper. This closed-loop tension control system can detect tension to stabilize the spatial position of the electrode wire in real time. Compared with molybdenum wire, experimental results show machining status between gaps are superior, with more breakdown delay. Surface roughness (Ra) is reduced from 0.902 to 0.552 mu m with combined processing of the twisted wire. The thickness of the recast layer is also reduced by 62% compared with multiple cutting of molybdenum wire, and the straightness error is significantly reduced.

引用

页码：2751 / 2759

页数：9

共 50 条

[11] Research into the sawing trajectory and mechanism of diamond wire saw
Liu, Baochang
Zhang, Zupei
Sun, Youhong
Wang, Jianyang
Jingangshi yu Moliao Moju Gongcheng/Diamond & Abrasives Engineering, 2002, (06):
[12] Research on cutting technology of underwater diamond wire saw
College of Mechanical and Electrical Engineering, Harbin Engineering University, Harbin 150001, China
Harbin Gongcheng Daxue Xuebao, 2006, 3 (429-433):
[13] Research on the Hydraulic Control System of Diamond Wire Saw
Cao, Liwen
2009 IEEE INTERNATIONAL CONFERENCE ON AUTOMATION AND LOGISTICS ( ICAL 2009), VOLS 1-3, 2009, : 652 - 657
[14] Research on Cutting Force of Ultrasonic Diamond Wire Saw
张辽远
李鑫
Journal of China Ordnance, 2010, (02) : 114 - 118
[15] EXPERIMENTAL AND NUMERICAL STUDIES OF WIRE VIBRATIONS IN BONDED ABRASIVE WIRE SAW PROCESSING
Tang, Aofei
Fan, Yang
Li, Shujuan
Landers, Robert G.
2016 INTERNATIONAL SYMPOSIUM ON FLEXIBLE AUTOMATION (ISFA), 2016, : 133 - 140
[16] Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis
Ge, Peiqi
Gao, Yufei
Li, Shaojie
Hou, Zhijian
ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV, 2009, 416 : 311 - 315
[17] Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw
Mengran Ge
Wenbo Bi
Peiqi Ge
Yuchao Bi
The International Journal of Advanced Manufacturing Technology, 2016, 87 : 1671 - 1676
[18] Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw
Ge, Mengran
Bi, Wenbo
Ge, Peiqi
Bi, Yuchao
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2016, 87 (5-8): : 1671 - 1676
[19] Research on the counterweight in the process of diamond wire saw cutting polysilicon
Zhang Liao-yuan
Wang Jian-guang
Yang Yong
Wang Chao
MATERIALS PROCESSING TECHNOLOGY, PTS 1-3, 2012, 418-420 : 1048 - 1055
[20] Research of PLC Control and Monitor System for Diamond Wire Saw
Li, Song-mei
Wang, Zhuo
Zhang, Jian-yong
INTERNATIONAL CONFERENCE ON ENERGY, ENVIRONMENT AND MATERIALS ENGINEERING (EEME 2014), 2014, : 795 - 799

← 1 2 3 4 5 →