Grain boundary engineering by application of mechanical stresses

被引：20
|
作者：
Winning, M [1 ]
机构：
[1] Rhein Westfal TH Aachen, Inst Met Kunde & Met Phys, D-52056 Aachen, Germany
来源：
SCRIPTA MATERIALIA | 2006年 / 54卷 / 06期
关键词：
grain growth; recrystallization; mechanical stress field; grain boundary engineering;
D O I：
10.1016/j.scriptamat.2005.11.042
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
It is shown that an externally applied mechanical stress field can drastically change grain growth as well as recrystallization kinetics and can strongly influence the microstructure evolution, so that the application of mechanical stresses during annealing can be used as a new approach in the field of grain boundary engineering. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：987 / 992
页数：6
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