Analysis of Effect of Process Parameters on Warpage of a automobile bumper injection molded parts

被引：1
|
作者：
Wu, Shuting [1 ]
Liu, Hongbin [1 ]
Wu, Haitao [1 ]
机构：
[1] Kunming Univ Sci & Technol, Fac Mech & Elect Engn, Kunming, Peoples R China
来源：
ADVANCES IN MATERIALS AND MATERIALS PROCESSING, PTS 1-3 | 2013年 / 652-654卷
关键词：
warpage; process parameters; numerical simulation; OPTIMIZATION;
D O I：
10.4028/www.scientific.net/AMR.652-654.2062
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Take a automobile bumper for example, analysis of effect of process parameters on warpage of a automobile bumper, including melt temperature, injection time, cooling time and packing pressure, on the warpage of the automobile bumper were analyzed by means of Moldflow software. The results show the warpage decrease of the increase of the injection time, the cooling time and the packing pressure, but when the packing pressure reached 45MPa, the warpage slightly increased; the melt temperature should be picked out by the characteristics of the plastics material.
引用
收藏
页码：2062 / 2066
页数：5
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