Investigation of short-circuit failure limited by dynamic-avalanche capability in 600-V punchthrough IGBTs

被引:12
|
作者
Oh, KH [1 ]
Kim, YC [1 ]
Lee, KH [1 ]
Yun, CM [1 ]
机构
[1] Fairchild Semicond, Device Concepts & Technol Dev, Kyuggdi 420711, South Korea
关键词
dynamic-avalanche capability; dynamic breakdown; insulated gate bipolar transistor (IGBT); short-circuit ruggedness;
D O I
10.1109/TDMR.2006.870338
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Short-circuit-failure energy of insulated gate bipolar transistors (IGBTs) is generally known to be constant, depending on the thermal capacity of the devices. However, apart from the intrinsic thermal-failure limit, a premature short-circuit failure was observed for 600-V punchthrough (PT) IGBTs at turn-off transition. The observed failure seems irrelevant to the electrical-failure mode as well as the thermal-failure mode, rather, it depends on the dynamic-breakdown voltage of the device. In this paper, with comprehensive investigations into an instant short-circuit failure, it is shown that the observed short-circuit failure of the PT IGBTs results from insufficient avalanche capability, which is initiated by dynamic-avalanche breakdown and can severely degrade the short-circuit ruggedness of the PT IGBTs independent of the duration of the short-circuit event.
引用
收藏
页码:2 / 8
页数:7
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