Influence of properties of Si3N4 passivation layer on the electrical characteristics of Normally-off AlGaN/GaN HEMT

被引:0
|
作者
Iucolano, F. [1 ]
Miccoli, C. [1 ]
Nicotra, M. [1 ]
Stocco, A. [2 ]
Rampazzo, F. [2 ]
Zanandrea, A. [2 ]
Martino, Cinnera, V [1 ]
Patti, A. [1 ]
Rinaudo, S. [1 ]
Soci, F. [3 ]
Chini, A. [3 ]
Zanoni, E. [2 ]
Meneghesso, G. [2 ]
机构
[1] STMicroelectronics, IMS R&D, Catania, Italy
[2] Univ Padua, Dept Informat Engn, Padua, Italy
[3] Univ Modena, Dept Engn Enzo Ferrari, Reggio Emilia, Italy
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper a comparison between two samples with two different SiN passivation layers was performed. An increment of the drain leakage current increasing the Si concentration in the SiN layer was observed. On the other hand, a similar behavior of dynamic R-ON was recorded. T-CAD simulations supported our hypothesis on the factors that cause parametric yield loss.
引用
收藏
页码:162 / 165
页数:4
相关论文
共 50 条
  • [31] Si3N4 layers for the in-situ passivation of GaN-based HEMT structures
    P. A. Yunin
    Yu. N. Drozdov
    M. N. Drozdov
    S. A. Korolev
    A. I. Okhapkin
    O. I. Khrykin
    V. I. Shashkin
    Semiconductors, 2015, 49 : 1421 - 1424
  • [32] High Performance Normally-Off AlGaN/GaN MIS-HEMT Using Charge Storage Technique
    Han, Ping-Cheng
    Yang, Chih-Yi
    Lee, Ming-Wen
    Wu, Jui-Sheng
    Wu, Chia-Hsun
    Chang, Edward Yi
    2019 COMPOUND SEMICONDUCTOR WEEK (CSW), 2019,
  • [33] Normally-off AlGaN/GaN MOS-HEMT using ultra-thin Al0.45Ga0.55N barrier layer
    Chakroun, Ahmed
    Jaouad, Abdelatif
    Bouchilaoun, Meriem
    Arenas, Osvaldo
    Soltani, Ali
    Maher, Hassan
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2017, 214 (08):
  • [34] Low-temperature characteristics of normally-off AlGaN/GaN-on-Si gate-recessed MOSHFETs
    Keum, Dongmin
    Kim, Hyungtak
    CRYOGENICS, 2018, 93 : 51 - 55
  • [35] Effect of GaN cap layer on the electrical properties of AlGaN/GaN HEMT
    Guo, Han
    Tang, Wu
    Zhou, Wei
    Li, Chiming
    ADVANCED MATERIALS AND PROCESS TECHNOLOGY, PTS 1-3, 2012, 217-219 : 2393 - 2396
  • [36] Charge Injection in Normally-Off p-GaN Gate AlGaN/GaN-on-Si HFETs
    Savadi, Luca
    Iannaccone, Giuseppe
    Sicre, Sebastien
    Lavanza, Simone
    Fiori, Gianluca
    Haberlen, Oliver
    Curatola, Gilberto
    2018 48TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC), 2018, : 18 - 21
  • [37] Investigation of the fabrication processes of AlGaN/AlN/GaN НЕМТs with in situ Si3N4 passivation
    K. N. Tomosh
    A. Yu. Pavlov
    V. Yu. Pavlov
    R. A. Khabibullin
    S. S. Arutyunyan
    P. P. Maltsev
    Semiconductors, 2016, 50 : 1416 - 1420
  • [38] Performance improvement of AlGaN/GaN HEMTs by surface treatment prior to Si3N4 passivation
    Institute of Microelectronics, Chinese Acad. of Sci., Beijing 100029, China
    Pan Tao Ti Hsueh Pao, 2008, 2 (329-333): : 329 - 333
  • [39] Normally-off characteristics of LiNbO3/AlGaN/GaN ferroelectric field-effect transistor
    Hao, L. Z.
    Zhu, J.
    Liu, Y. J.
    Liao, X. W.
    Wang, S. L.
    Zhou, J. J.
    Kong, C.
    Zeng, H. Z.
    Zhang, Y.
    Zhang, W. L.
    Li, Y. R.
    THIN SOLID FILMS, 2012, 520 (19) : 6313 - 6317
  • [40] Low Ohmic-Contact Resistance in Recessed-Gate Normally-off AlGaN/GaN MIS-HEMT with δ-Doped GaN Cap Layer
    Wakejima, A.
    Ando, A.
    Watanabe, A.
    Inoue, K.
    Kubo, T.
    Nagai, T.
    Kato, N.
    Osada, Y.
    Kamimura, R.
    Egawa, T.
    2015 73RD ANNUAL DEVICE RESEARCH CONFERENCE (DRC), 2015, : 59 - 60