Simulation of microparticle motion and contamination in plasma coating systems

被引:1
|
作者
Schulz, Philipp [1 ]
Pflug, Andreas [1 ]
Kricheldorf, Hans-Ulrich [1 ]
机构
[1] Fraunhofer Inst Surface Engn & Thin Films IST, Bienroder Weg 54E, D-38108 Braunschweig, Germany
来源
关键词
DUSTY PLASMA;
D O I
10.1116/1.5130720
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The authors developed a microparticle simulation for low-pressure plasma environments occurring in certain plasma coating systems. The simulation is based on a theoretical model for the forces and currents acting on microparticles and takes place in a 3D geometry modeled after the coating chamber. As a test case, the Enhanded Optical Sputtering System was used, and the resulting size distribution functions for two different microparticle species were compared with experimental size distributions, showing a qualitative agreement and yielding some explanations for the experimental results.
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页数:8
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