Application of Fluorine Doped SiO2 Films for Temperature Compensated SAW Devices

被引:11
|
作者
Matsuda, S. [1 ,2 ]
Hara, M. [1 ]
Miura, M. [1 ]
Matsuda, T. [1 ]
Ueda, M. [1 ]
Satoh, Y. [1 ]
Hashimoto, K. [2 ]
机构
[1] TAIYO YUDEN CO LTD, Hyogo, Japan
[2] Chiba Univ, Grad Sch Engn, Chiba, Japan
关键词
component; TC; SiO2; FT-IR; peak frequency; bond angle; FWHM; TRANSFORM INFRARED-SPECTRA; ACOUSTIC-WAVE DUPLEXER; FILMS;
D O I
10.1109/ULTSYM.2011.0020
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In our paper, we investigates acoustic properties including temperature coefficient of elasticity (TCE) of fluorine doped silicon oxide (SiOF) films and proposes their application to the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. From the Fourier transform infrared spectroscopy (FT-IR), SiOF films were expected to possess good TCE properties. Then we fabricated a series of SAW devices using the SiOF-overlay/Cu-grating/LiNbO3-substrate structure, and their device performances were evaluated. The experiments showed that the temperature coefficient of frequency (TCF) increases with the fluorine content r, as we expected from the FT-IR measurement. This means that the Si-O-Si atomic structure measurable by the FT-IR governs the TCE behavior of SiO2-based films even when the dopant is added. In comparison with the pure SiO2 with the film thickness h of 0.3 wavelengths (lambda), TCF was improved by 7.7 ppm/degrees C without deterioration of the effective electromechanical coupling factor K-2 when r=3.8 atomic % and h=0.28 lambda. The F inclusion did not influence the resonator Q factors obviously when r<8.8 atomic%.
引用
收藏
页码:76 / 78
页数:3
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