Production and measurement of large-area moisture barriers for electronic applications

被引:0
|
作者
Bird, David [1 ]
Cook, Andrew [1 ]
Melgari, Paolo [1 ]
Robbins, David [1 ]
Hollis, Phil [1 ]
Brewer, Paul [2 ]
Ferracci, Valerio [2 ]
机构
[1] CPI, Thomas Wright Way,NETPk, Sedgefield TS21 3FG, Durham, England
[2] Natl Phys Lab, Analyt Sci Div, Hampton Rd, Teddington TW11 0LW, Middx, England
关键词
ATOMIC LAYER DEPOSITION; WATER-VAPOR; PERFORMANCE;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The use of organic electronic materials, combined with the desire to produce lightweight & low cost flexible devices, raises the need to develop a commercially viable technology which limits the impact of the active material's intrinsic environmental instability. CPI has been involved in the area of barrier film and encapsulation development for many years and with its development with Beneq of R2R Atomic Layer Deposition (ALD) processes is actively engaging with the industry to meet this technology need. This work reviews the existing technologies and highlights the barrier and associated metrology technologies being developed at CPI's National Printable Electronics Facility, including a variant of calcium-test which has been calibrated to the mass standard. The aim of all this work is to reduce costs and improve the manufacturability of these materials for a commercial/industrial environment.
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页数:6
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