Drop Test Performance of Isotropic Electrically Conductive Adhesives

被引：3

作者：

Morris, James E. ^{[1
]}

Lee, Jeahuck ^{[1
]}

机构：

[1] Portland State Univ, Dept Elect & Comp Engn, Portland, OR 97207 USA

来源：

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 2008年 / 22卷 / 14期

关键词：

Electrically conductive adhesives (ECAs); isotropic conductive adhesives (ICAs); glass transition temperature (T-g); cure temperature; drop test;

D O I：

10.1163/156856108X320546

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Drop test survival is a crucial element of isotropic conductive adhesive (ICA) reliability. Drop test data are presented for four different ICA materials, with varying cure profiles. Only one of the materials passes the ad hoc standard (including none of the "snap cure" formulations, although performance is improved by extended cure times). Drop test performance deteriorates when the sample has survived a series of smaller drops, leading to a cumulative damage model based on crack initiation at interface bubbles, and is improved by a pre-cure heat soak to drive off the bubbles. (c) Koninklijke Brill NV, Leiden, 2008

引用

页码：1699 / 1716

页数：18

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