HYDROGENATED AMORPHOUS SILICON CARBON NITRIDE FILMS PREPARED BY PECVD TECHNOLOGY: PROPERTIES

Hydrogenated amorphous silicon carbon nitride films were grown by plasma enhanced chemical vapor deposition (PECVD) technique. The flow rates of SiH4, CH4 and NH3 gases were 6 sccm, 30 sccm and 8 sccm, respectively. The deposition temperatures were 350, 400 and 450 degrees C. The RBS and ERD results showed that the concentrations of Si, C, N and FT are practically the same in the films deposited at substrate temperatures in the range 350-450 degrees C. In photoluminescence spectra we identified two peaks and assigned them to radiative transitions typical for amorphous materials, ie band to band and defect-related ones. The electrical characterization consists of I(V) measurement in sandwich configuration for voltages up to 100 V. From electrical characterization, it was found that with increased deposition temperature the resistivity of the amorphous SiCN film was reduced.