Aerosol deposition of thermoelectric p-type Bi0.5Sb1.5Te3 and n-type Bi2Te2.7Se0.3 thick films

被引:0
|
作者
Kwak, Min Hwan [1 ]
Kang, Seung Beom [2 ]
Kim, Jeong Hun [3 ]
Lee, Jaewoo [3 ]
Lee, Seung-Min [3 ]
Kim, Won-Jeong [4 ]
Moon, Seung Eon [3 ]
机构
[1] Changwon Moonsung Univ, Dept Elect Engn, Chang Won 51410, South Korea
[2] Korea Inst Carbon Convergence Technol, Jeonju 54853, South Korea
[3] Elect & Telecommun Res Inst, Daejeon 34129, South Korea
[4] Changwon Natl Univ, Dept Phys, Chang Won 51140, South Korea
来源
关键词
Thermoelectric materials; Seebeck coefficient; Electrical properties; Aerosol deposition; ROOM-TEMPERATURE; POWDER;
D O I
暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A new aerosol deposition method was used to fabricate thick Bi-Te based thermoelectric films, such as p-type Bi0.5Sb1.5Te3 and n-type Bi2Te2.7Se0.3. The fabricated films exhibited dense morphologies without any large-scale porosity. Measured films thicknesses of Bi0.5Sb1.5Te3 and Bi2Te2.7Se0.3 were 276 mu m and 557 mu m, respectively. The thermoelectric properties of p-type Bi0.5Sb1.5Te3 and n-type Bi2Te2.7Se0.3 were measured to be 1.18 x 10(4) S/m and 0.7 x 10(4) S/m of electrical conductivities, 230.1 mu V/K and -178 mu V/K of Seebeck coefficients, 0.62 mW/mK(2) and 0.21 mW/mK(2) of power factors, respectively. It was demonstrated that the aerosol deposition is a promising thick film fabrication method for improving the thermoelectric efficiency of the thermoelectric materials.
引用
收藏
页码:731 / 734
页数:4
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