Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique

被引：0

作者：

Stoukatch, S. ^{[1
]}

Laurent, P. ^{[1
]}

Dricot, S. ^{[1
]}

Axisa, F. ^{[1
]}

Seronveaux, L. ^{[2
]}

Vandormael, D. ^{[2
]}

Beeckman, E. ^{[2
]}

Heusdens, B. ^{[3
]}

Destine, J. ^{[1
]}

机构：

[1] Univ Liege, EMMI Microsys, B-4000 Liege, Belgium

[2] SIRRIS, Collect Ctr Belgium Technol Ind, B-4102 Liege, Belgium

[3] TAIPRO Engn, B-4102 Seraing, Belgium

来源：

2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) | 2012年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer. We realized a fully functional working prototype of Autonomous Wireless Sensor Node system using AJP silver conductive track as an electrical interconnection.

引用

页数：5

共 45 条

[21] Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology
Lall, Pradeep
Soni, Ved
Hill, Curtis
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021), 2021, : 1073 - 1084
[22] Evaluation of inkjet technology for electronic packaging and system integration
Maentysalo, Matti
Mansikkamaeki, Pauliina
Miettinen, Jani
Kaija, Kimmo
Pienimaa, Seppo
Roenkkae, Risto
Hashizume, Kenichi
Kamigori, Akiko
Matsuba, Yorishige
Oyama, Kenshu
Terada, Nobuto
Saito, Hiroshi
Kuchiki, Mikiharu
Tsubouchi, Mikihiko
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 89 - +
[23] A Comparison of the Interdigital Electrodes Prepared by Aerosol Jet Printing and Lift-Off Technique
Soukup, Radek
Navratil, Jiri
Reboun, Jan
Rericha, Tomas
2015 38TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2015), 2015, : 30 - 35
[24] High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing
Sturim, Nicholas
Hodek, Matt
Chahal, Premjeet
Albrecht, John
Papapolymerou, John
2023 53RD EUROPEAN MICROWAVE CONFERENCE, EUMC, 2023, : 14 - 17
[25] A NEW ELECTROMIGRATION TESTING TECHNIQUE FOR RAPID STATISTICAL EVALUATION OF INTERCONNECT TECHNOLOGY
THOMPSON, CV
CHO, J
IEEE ELECTRON DEVICE LETTERS, 1986, 7 (12) : 667 - 668
[26] Evaluation of Aerosol Jet Printing of Frequency Selective Surface on Glass for Building and RF Applications
Shastri, A.
Putta, K.
Sanz-Izquierdo, B.
Parker, E. A.
Gao, S.
Winchester, L.
McClelland, A.
2020 14TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP 2020), 2020,
[27] Evaluation of the Curing Process Effects on the TCR of Temperature Sensors Printed by Aerosol Jet Printing
Fapanni, Tiziano
ElBidweihy, Hatem
Zappa, Dario
Comini, Elisabetta
Sardini, Emilio
Serpelloni, Mauro
IEEE SENSORS JOURNAL, 2023, 23 (15) : 16625 - 16632
[28] Printing polymer optical Waveguides on conditioned transparent flexible Foils by using the Aerosol Jet Technology
Reitberger, Thomas
Hoffmann, Gerd-Albert
Wolfer, Tim
Overmeyer, Ludger
Franke, Joerg
PRINTED MEMORY AND CIRCUITS II, 2016, 9945
[29] Novel materials for electronic device fabrication using ink-jet printing technology
Kumashiro, Yasushi
Nakako, Hideo
Inada, Maki
Yamamoto, Kazunori
Izumi, Akira
Ishihara, Masamichi
APPLIED SURFACE SCIENCE, 2009, 256 (04) : 1019 - 1022
[30] Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging
Zhan Zhan
Lingke Yu
Jin Wei
Cheng Zheng
Daoheng Sun
Lingyun Wang
Microsystem Technologies, 2015, 21 : 451 - 455

← 1 2 3 4 5 →