TCAD-Based Investigation of a 650 V 4H-SiC Trench MOSFET with a Hetero-Junction Body Diode

被引:3
|
作者
Wang, Ruoyu [1 ]
Guo, Jingwei [1 ]
Liu, Chang [1 ]
Wu, Hao [1 ,2 ]
Huang, Zhiyong [1 ]
Hu, Shengdong [1 ]
机构
[1] Chongqing Univ, Sch Microelect & Commun Engn, Chongqing Engn Lab High Performance Integrated Ci, Chongqing 400044, Peoples R China
[2] Natl Lab Sci & Technol Analog Integrated Circuits, Chongqing 401332, Peoples R China
基金
中国国家自然科学基金;
关键词
silicon carbide; heterojunction diode; trench MOSFET; TEMPERATURE; SEMICONDUCTOR; MOBILITY; VOLTAGE; GATE;
D O I
10.3390/mi13101741
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
In this paper, a 650 V 4H-SiC trench Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) with a hetero-junction diode (HJD) and double current spreading layers (CSLs) is proposed and studied based on Sentaurus TCAD simulation. The HJD suppresses the turn-on of the parasitic body diode and improves the performance in the third quadrant. CSLs with different doping concentrations help to lower the on-state resistance as well as the gate-drain capacitance. As a result, the on-state resistance is decreased by 47.82% while the breakdown voltage remains the same and the turn-on and turn-off losses of the proposed structure are reduced by 83.39% and 68.18% respectively, compared to the conventional structure.
引用
收藏
页数:10
相关论文
共 50 条
  • [41] Investigation on the junction temperature of planar power 4H-SiC MOSFET under short circuit operation
    Nguyen, Tien Anh
    Lefebvre, Stephane
    Azzopardi, Stephane
    Chaplier, Gerard
    MICROELECTRONICS RELIABILITY, 2022, 138
  • [42] Reliability Investigation on SiC Trench MOSFET under Repetitive Surge Current Stress of Body Diode
    Wang, Zhenyu
    Li, Yunjia
    Sun, Xiaohua
    Liu, Ye
    Zhu, Zhengyun
    Ren, Na
    Guo, Qing
    2020 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA), 2020,
  • [43] Study of Asymmetric Cell Structure Tilt Implanted 4H-SiC Trench MOSFET
    Ni, Weijiang
    Wang, Xiaoliang
    Xu, Miaolin
    Wang, Quan
    Feng, Chun
    Xiao, Honglin
    Jiang, Lijuan
    Li, Wei
    IEEE ELECTRON DEVICE LETTERS, 2019, 40 (05) : 698 - 701
  • [44] 4H-SiC trench MOSFET with splitting double-stacked shielded region
    Yang, Tongtong
    Bai, Song
    Huang, Runhua
    SUPERLATTICES AND MICROSTRUCTURES, 2018, 122 : 419 - 425
  • [45] A Novel 4H-SiC Trench MOSFET Integrated With Mesa-Sidewall SBD
    Han, Zhonglin
    Bai, Yun
    Chen, Hong
    Li, Chengzhan
    Lu, Jiang
    Yang, Chengyue
    Yao, Yao
    Tian, Xiaoli
    Tang, Yidan
    Song, Guan
    Liu, Xinyu
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, 68 (01) : 192 - 196
  • [46] An Optimized Structure of 4H-SiC U-Shaped Trench Gate MOSFET
    Wang, Ying
    Tian, Kai
    Hao, Yue
    Yu, Cheng-Hao
    Liu, Yan-Juan
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (09) : 2774 - 2778
  • [47] Fabrication and characteristics of a 4H-SiC junction barrier Schottky diode
    Chen Fengping
    Zhang Yuming
    Lue Hongliang
    Zhang Yimen
    Guo Hui
    Guo Xin
    JOURNAL OF SEMICONDUCTORS, 2011, 32 (06)
  • [48] TCAD-based Investigation of a 3.3 kV Planar SiC MOSFET: BV-RON Trade-Off Optimization
    Scognamillo, Ciro
    Catalano, Antonio Pio
    d'Alessandro, Vincenzo
    Riccio, Michele
    Borghese, Alessandro
    Maresca, Luca
    Irace, Andrea
    Breglio, Giovanni
    Rahimo, Munaf
    Nistor, Iulian
    Antoniou, Marina
    Melnyk, Kyrylo
    Lophitis, Neophytos
    18TH INTERNATIONAL CONFERENCE ON COMPATIBILITY, POWER ELECTRONICS AND POWER ENGINEERING, CPE-POWERENG 2024, 2024,
  • [49] 4H-SiC trench MOSFET with an integrated Schottky barrier diode and L-shaped P+ shielding region
    Xiaorong Luo
    Ke Zhang
    Xu Song
    Jian Fang
    Fei Yang
    Bo Zhang
    Journal of Semiconductors, 2020, 41 (10) : 86 - 90
  • [50] 4H-SiC trench MOSFET with an integrated Schottky barrier diode and L-shaped P+ shielding region
    Luo, Xiaorong
    Zhang, Ke
    Song, Xu
    Fang, Jian
    Yang, Fei
    Zhang, Bo
    JOURNAL OF SEMICONDUCTORS, 2020, 41 (10)