Thermal Performance Analysis and Optimization of Microjet Cooling of High-Power Light-Emitting Diodes

被引:16
|
作者
Husain, Afzal [1 ]
Kim, Sun-Min [1 ]
Kim, Jun-Hee [1 ]
Kim, Kwang-Yong [1 ]
机构
[1] Inha Univ, Dept Mech Engn, Inchon 402751, South Korea
基金
新加坡国家研究基金会;
关键词
ENHANCED MULTIOBJECTIVE OPTIMIZATION; SMALL HEAT-SOURCES; CORRELATING EQUATIONS; IMPINGEMENT; SYSTEM; MANAGEMENT; ARRAYS;
D O I
10.2514/1.T3931
中图分类号
O414.1 [热力学];
学科分类号
摘要
The present study investigates the thermal and hydraulic performance of the microjet array cooling system for thermal management of a high-power light-emitting diode array. Three-dimensional numerical analyses were performed for steady incompressible turbulent flow and conjugate heat transfer through a finite volume solver. The performances of several microjet array configurations, viz., 1-jet, 4-jet, 9-jet, 13-jet, and 16-jet arrays, were analyzed at two flow rates and top-cavity heights. The design optimization of a 4-jet array cooling system was performed using a multi-objective evolutionary algorithm. For the optimization, two design variables, viz., ratio of the nozzle diameter and height of the top cavity and ratio of the height and length of the top cavity, were selected. The thermal resistance and pressure drop were selected as the objective functions of the design. The Pareto-optimal solutions were obtained and discussed in view of the thermal resistance and pressure drop and sensitivity of design variables to objective functions.
引用
收藏
页码:235 / 245
页数:11
相关论文
共 50 条
  • [11] Thermal effects on spectral modulation properties of high-power light-emitting diodes
    Vaitonis, Zenonas
    Vitta, Pranciskus
    Jakstas, Vytautas
    Zukauskas, Arturas
    PHOTONIC FIBER AND CRYSTAL DEVICES: ADVANCES IN MATERIALS AND INNOVATIONS IN DEVICE APPLICATIONS V, 2011, 8120
  • [12] Thermal characterizations analysis of high-power ThinGaN cool-white light-emitting diodes
    Raypah, Muna E.
    Devarajan, Mutharasu
    Ahmed, Anas A.
    Sulaiman, Fauziah
    JOURNAL OF APPLIED PHYSICS, 2018, 123 (10)
  • [13] Structural optimization and numerical thermal analysis of ultraviolet light-emitting diodes with high-power multi-chip arrays
    Liang, S.
    Hao, R.
    Fan, D.
    Li, B.
    Huang, J.
    Zhang, Y.
    Wu, J.
    Li, Y.
    Mo, J.
    OPTIK, 2020, 222
  • [14] Experimental Study on Active Cooling Systems Used for Thermal Management of High-Power Multichip Light-Emitting Diodes
    Kaya, Mehmet
    SCIENTIFIC WORLD JOURNAL, 2014,
  • [15] Thermal analysis of high-power light-emitting diode packages
    Ma, Ze-Tao
    Zhu, Da-Qing
    Wang, Xiao-Jun
    Bandaoti Guangdian/Semiconductor Optoelectronics, 2006, 27 (01): : 16 - 19
  • [16] Research on dynamic thermal performance of high-power ThinGaN vertical light-emitting diodes with different submounts
    Raypah, Muna E.
    Mahmud, Shahrom
    Devarajan, Mutharasu
    AlShammari, Anoud Saud
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2020, 35 (12)
  • [17] Transparent Functionalized Zinc Oxide/Epoxy Nanocomposite with High Thermal Performance for High-Power Light-Emitting Diodes
    Zhang, Min
    Zhang, Kai
    Zhang, Xinfeng
    Yang, Chen
    Yuen, Matthew Ming-Fai
    14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,
  • [18] A Thermal Management System to Reuse Thermal Waste Released by High-Power Light-Emitting Diodes
    Wang, Ning
    Gao, Cong
    Ding, Can
    Jia, Hong-Zhi
    Sui, Guo-Rong
    Gao, Xiu-Min
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (11) : 4790 - 4797
  • [19] Performance of high-power AlInGaN light emitting diodes
    Kim, AY
    Götz, W
    Steigerwald, DA
    Wierer, JJ
    Gardner, NF
    Sun, J
    Stockman, SA
    Martin, PS
    Krames, MR
    Kern, RS
    Steranka, FM
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2001, 188 (01): : 15 - 21
  • [20] Optical Analysis of Phosphor's Location for High-Power Light-Emitting Diodes
    Liu, Zongyuan
    Liu, Sheng
    Wang, Kai
    Luo, Xiaobing
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2009, 9 (01) : 65 - 73