Spatial distribution of current density and thermal resistance of high-power AlInGaInN "vertical" and "face-up" light-emitting diodes

被引：0
|
作者：
Aladov, A. V. [1 ]
Kuptsov, V. D. [2 ]
Chernyakov, A. E. [1 ]
Zakgeim, A. L. [1 ]
Valyukhov, V. P. [2 ]
机构：
[1] RAS, Submicron Heterostruct Microelect Res & Engn Ctr, 26 Politekhnicheskaya St, St Petersburg, Russia
[2] Peter Great St Petersburg Polytech Univ, 29 Politekhnicheskaya St, St Petersburg, Russia
来源：
OPTICAL DESIGN AND TESTING VII | 2016年 / 10021卷
关键词：
high-power flip-chip vertical LED; face-up LED; thermal resistance; current crowding; near-field; electroluminescence;
D O I：
10.1117/12.2242939
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
This paper presents a comprehensive analysis of the electroluminescence (EL) and current distributions in connection with heat transfer (thermal resistance) in high-power "vertical" and "face-up" AlGaInN light emitting diodes (LEDs). The study was carried out using a combination of high-resolution EL mapping techniques giving information on the lateral distributions of near-field light emission intensity and thermal transient measurements for evaluation of thermal resistance of LEDs and its elements. It was shown that poor current spreading at high current density causes increase in thermal resistance.
引用
收藏
页数：6
相关论文
共 50 条
  • [21] Experimental investigation of high-power light-emitting diodes' thermal management by ionic wind
    Wang, Jing
    Cai, Yi-xi
    Li, Xiao-hua
    Zhao, Xu-dong
    Wang, Jun
    Shi, Yun-fei
    Shi, Yun-xi
    APPLIED THERMAL ENGINEERING, 2017, 122 : 49 - 58
  • [22] Thermal Performance Analysis and Optimization of Microjet Cooling of High-Power Light-Emitting Diodes
    Husain, Afzal
    Kim, Sun-Min
    Kim, Jun-Hee
    Kim, Kwang-Yong
    JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2013, 27 (02) : 235 - 245
  • [23] Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes
    Ye, Huaiyu
    Li, Bo
    Tang, Hongyu
    Zhao, Jia
    Yuan, Cadmus
    Zhang, Guoqi
    MICROELECTRONICS RELIABILITY, 2014, 54 (11) : 2448 - 2455
  • [24] Temperatures and thermal stresses in high-power light emitting diodes
    Key Laboratory of Heat Transfer and Energy Conversion of Beijing Municipality, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
    Qinghua Daxue Xuebao/Journal of Tsinghua University, 2007, 47 (08): : 1380 - 1383
  • [25] Development of high-efficiency and high-power vertical light emitting diodes
    Hahn, Berthold
    Galler, Bastian
    Engl, Karl
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2014, 53 (10)
  • [26] Lifetime enhancement of high-power light-emitting diodes using thermal paths in ceramic package
    Ma, B.
    Kim, J.
    ELECTRONICS LETTERS, 2012, 48 (03) : 161 - U56
  • [27] Thermal Analysis of High-Power Multichip COB Light-Emitting Diodes With Different Chip Sizes
    Ying, Shang-Ping
    Shen, Wei-Bo
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (03) : 896 - 901
  • [28] Thermal characterizations analysis of high-power ThinGaN cool-white light-emitting diodes
    Raypah, Muna E.
    Devarajan, Mutharasu
    Ahmed, Anas A.
    Sulaiman, Fauziah
    JOURNAL OF APPLIED PHYSICS, 2018, 123 (10)
  • [29] High-Power Light-Emitting Diodes Package With Phase Change Material
    Zhao, Yu
    Liu, Jun
    Wei, Aixiang
    Li, Jian
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (11): : 1747 - 1753
  • [30] InGaAlP and InGaN light-emitting diodes: high-power performance and reliability
    Eliashevich, I
    Debray, JP
    Tran, CA
    Venugopalan, H
    Karlicek, RF
    LIGHT-EMITTING DIODES: RESEARCH, MANUFACTURING, AND APPLICATIONS IV, 2000, 3938 : 44 - 51
12345