Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

被引：154

作者：

Wang, Shuai ^{[1
]}

Li, Mingyu ^{[1
,2
]}

Ji, Hongjun ^{[1
]}

Wang, Chunqing ^{[2
]}

机构：

[1] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen Key Lab Adv Mat, Shenzhen 518055, Peoples R China

[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

来源：

SCRIPTA MATERIALIA | 2013年 / 69卷 / 11-12期

关键词：

Ag nanoparticle; Sintering; Bonding; Thermal conductivity; Twinning; THERMAL-CONDUCTIVITY; DEPENDENCE;

D O I：

10.1016/j.scriptamat.2013.08.031

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

This paper describes a method to achieve rapid pressureless low-temperature sintering of Ag nanoparticles for bonding. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them were thinned to create a sparse protecting layer. The numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 mu induce ultrahigh thermal conductivity (229 W m(-1) K-1), which overcomes the intrinsic defect that metals with nanosized grains generally exhibit a significantly reduced thermal conductivity because of the grain boundary scattering effect. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：789 / 792

页数：4

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