LQFP Warpage Optimization Based on Variance Analysis Method

被引：0
|
作者：
Jin Lingyue [1 ]
Sun Haiyan [1 ]
Zhao Jicong [1 ]
Sun Ling [1 ]
Fang Jiaen [2 ]
机构：
[1] Nantong Univ, Jiangsu Key Lab ASIC Design, Nantong, Peoples R China
[2] U Pkg Technol Co Ltd, Chengdu, Peoples R China
来源：
ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2019年
基金：
中国国家自然科学基金;
关键词：
warpage; low-profile quad flat; finite element analysis; orthogonal experimental design; variance analysis;
D O I：
10.1109/ICEPT47577.2019.245145
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In order to analyze the warpage of package products during the process of post-molding, the simulation of a kind of low-profile quad flat (LQFP) was carried out. With the mechanical module in ANSYS workbench, the influence of epoxy molding compounds (EMC), chip and leadframe (LF) thickness on warpage are studied. The simulation results show that when the thickness of EMC is increased, the warpage of LQFP is reduced. While the thickness of the chip or the leadframe increased, its warpage become worse. Moreover, variance analysis shows that the thickness of EMC, chip and leadframe affect warpage in a descending order. The work can provide an effective reference for reducing the warpage when designing similar products.
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页数：4
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