Wafer-level three-dimensional hyper-integration technology using dielectric adhesive wafer bonding

被引：4
|
作者：
Lu, JQ [1 ]
Cale, TS [1 ]
Gutmann, RJ [1 ]
机构：
[1] Rensselaer Polytech Inst, Ctr Integrated Elect, New York, NY USA
来源：
MATERIALS FOR INFORMATION TECHNOLOGY: DEVICES, INTERCONNECTS AND PACKAGING | 2005年
关键词：
D O I：
10.1007/1-84628-235-7_33
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：405 / 417
页数：13
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