InAs-based metal-oxide-semiconductor structure formation in low-energy Townsend discharge

被引:13
|
作者
Aksenov, M. S. [1 ,2 ]
Kokhanovskii, A. Yu. [2 ]
Polovodov, P. A. [2 ]
Devyatova, S. F. [1 ]
Golyashov, V. A. [1 ,2 ]
Kozhukhov, A. S. [1 ,2 ]
Prosvirin, I. P. [2 ,3 ]
Khandarkhaeva, S. E. [2 ]
Gutakovskii, A. K. [1 ,2 ]
Valisheva, N. A. [1 ]
Tereshchenko, O. E. [1 ,2 ]
机构
[1] RAS, Rzhanov Inst Semicond Phys, SB, Novosibirsk 630090, Russia
[2] Novosibirsk State Univ, Novosibirsk 630090, Russia
[3] RAS, Boreskov Inst Catalysis, SB, Novosibirsk 630090, Russia
关键词
ELECTRONIC-PROPERTIES; SURFACE; BREAKDOWN;
D O I
10.1063/1.4934745
中图分类号
O59 [应用物理学];
学科分类号
摘要
We developed and applied a method of InAs passivation in the low-energy plasma of Townsend discharge. The controlled interface oxidation in the Ar:O-2:CF4 gas mixture under visualization of gas discharge plasma allowed growing thin homogeneous films in the range of 5-15 nm thickness. Oxidation with the addition of CF4 in gas-discharge plasma led to the formation of In and As oxyfluorides with a wide insulating gap and isostructural interface with unpinned Fermi level behavior. The metal-oxide-semiconductor structure showed excellent capacitance-voltage characteristics: small frequency dispersion (<15 mV), density of interface states (D-it) in the gap below 5 x 10(10) eV(-1) cm(-2), and fixed charge (Q(fix)) below 5 x 10(11) cm(-2). (C) 2015 AIP Publishing LLC.
引用
收藏
页数:5
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